This letter describes the heteroepitaxy of
InP on Si by MOCVD. A new epitaxial structure with a thin GaAs intermediate
layer (InP/GaAs/Si) is proposed to alleviate the large lattice mismatch (8.4%)
between InP and Si. Using this structure, a 4-inch InP single crystal with a
mirror-like surface and good thickness uniformity (Δd/d=±10%) was obtained.
Residual stress in the InP film was 5.7±108 dyn/ cm2 for the InP/GaAs/Si
structure, as compared to 8.3×108 dyn/cm2 for the InP directly grown on Si.
This shows that the GaAs intermediate layer is also effective in reducing the
residual stress in the InP epilayer.
Source:IOPscience
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