Room-temperature light emission at a wavelength of 2.86 µm was observed for In0.53Ga0.47As0.99N0.01/GaAs0.5Sb0.5 type-II quantum well (QW) diodes grown on InP substrates by molecular beam epitaxy (MBE), which is much longer than that (2.34 µm) for In0.53Ga0.47As/GaAs0.5Sb0.5 type-II QW diodes on InP substrates. The temperature dependence of the electroluminescence (EL) spectrum indicates that the EL peak energy difference between these two diodes is 100 meV at all temperatures.
The focus of this paper is to present the calculations of the band alignment of indium-rich (>53%) highly strained Ga1−xInxNyAs1−y quantum wells on InP substrates which allows an emission wavelength of the order of 2.3 µm. We concentrate on the band alignment of Ga0.22In0.78N0.01As0.99 wells lattice matched to In0.52Al0.48As barriers. Our calculations show that the incorporation of nitrogen into Ga1−xInxAs improves the band alignment significantly allowing Ga0.22In0.78N0.01As0.99/In0.52Al0.48As quantum wells on InP substrates to compete with the unique band alignment of GaInNAs/GaAs quantum wells on GaAs substrates.
We search for optimum growth conditions to realize flat BiTe layers on InP(111)B by hot wall epitaxy. The substrate provides a relatively small lattice mismatch, and so (0001)-oriented layers grow semicoherently. The temperature window for the growth is found to be narrow due to the nonzero lattice mismatch and rapid re-evaporation of BiTe. The crystalline qualities evaluated by means of x-ray diffraction reveal deteriorations when the substrate temperature deviates from the optimum not only to low temperatures but also to high temperatures. For high substrate temperatures, the Bi composition increases as Te is partially lost by sublimation. We show, in addition, that the exposure of the BiTe flux at even higher temperatures results in anisotropic etching of the substrates due, presumably, to the Bi substitution by the In atoms from the substrates. By growing BiTe layers on InP(001), we demonstrate that the bond anisotropy on the substrate surface gives rise to a reduction in the in-plane epitaxial alignment symmetry.
The bonding-temperature-dependent lasing characteristics of 1.5 a µm GaInAsP laser diode (LD) grown on a directly bonded InP/Si substrate were successfully obtained. We have fabricated the Si orInP substrate using a direct hydrophilic wafer bonding technique at bonding temperatures of 350, 400, and 450 °C, and deposited GaInAsP or InP double heterostructure layers on this InP/Si substrate. The surface conditions, X-ray diffraction (XRD) analysis, photoluminescence (PL) spectra, and electrical characteristics after the growth were compared at these bonding temperatures. No significant differences were confirmed in X-ray diffraction analysis and PL spectra at these bonding temperatures. We realized the room-temperature lasing of the GaInAsP LD on the InP/Si substrate bonded at 350 and 400 °C. The threshold current densities were 4.65 kA/cm2 at 350 °C and 4.38 kA/cm2 at 400 °C. The electrical resistance was found to increase with annealing temperature.