We report on the fabrication of III–V compound semiconductor
multi-junction solar cells using the room-temperature wafer bonding technique.
GaInP/GaAs dual-junction solar cells on GaAs substrate and InGaAsP single
junction solar cell on InP substrate were separately grown by all-solid state
molecular beam epitaxy (MBE). The two cells were then bonded to a
triple-junction solar cell at room-temperature. A conversion efficiency of 30.3%
of GaInP/GaAs/InGaAsP wafer-bonded solar cell was obtained at 1-sun condition
under the AM1.5G solar simulator. The result suggests that the room-temperature
wafer bonding technique and MBE technique have a great potential to improve the
performance of multi-junction solar cell.
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