In this report, we investigate the profiles
of zinc (Zn) in n-type InP 100 single crystal wafers and InGaAs epitaxial film
prepared by semi-closed ampoule Zn diffusion. The different annealing effect on
junction depth and concentration for InP and InGaAs is studied, and the
difference is tentatively ascribed to solubility for each material. The maximum
net acceptor concentration in InP changes from 3.3 × 1017 cm−3 to 3.3 × 1018
cm−3 before and after annealing, and the later value is close to the solubility
limit for closed-ampoule Zn diffusion InP. Annealing does not make the maximum
net acceptor concentration and depth in InGaAs change much. Our experiments
show that Zn diffusion InGaAs can be used as a good ohmic contact material for
photoelectric devices due to its high acceptor concentration.
Source:IOPscience
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